Packaging Machinery – News, Technology and Reviews

Green ICT products are always talked about but packaging used for their delivery is very rarely discussed. ICT companies have introduced many packaging solutions like mushroom based cushioning and boxes that double up as PC cases. There’s a lot of advancement in the method of packaging IT equipments like earlier IT equipments were packed in [...]

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The latest report on technological study and market research conducted by Yole Devalopments on Flip Chip has been successfully published. This report contains complete information about flip chip markets, applications of this technnnology, wafer bumping to assembly and the various technologis used in substrates and underfilled materials. A detailed analysis of the cost, supply, value [...]

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The battle for good packaging solutions for electronics products like circuit cards, components, electronics devices etc, is getting tougher and tougher with different companies rolling out better and better solutions into the market. Liberty Packaging has come with its own innovative solution which it calls ATCI packaging. This new technology imparts protection against the most [...]

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The International Conference on Elactronics Packaging was held recently from April 13th to April 15th in Nara, Japan. Many laeding companies from the chip market were present for the occassion. The president and founder of TechSearch International, E.Jan Vardaman delivered a key note address and one important point highlighted in her address was the growing [...]

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On April, 5th 2011 during the TSMC 2011 Technology Symposium the Taiwan Semiconductor Manufacturing Company Ltd. announced its plans to expand its efforts in the field of IC- packaging. The silicon giant has been into the manufacture of parts for backend puzzle like wafer bumping, wafer sort and wafer-level chip scale packaging. On a limited [...]

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Plastic tube packaging is used almost all over the world now for packaging water to stuff like chocolates, medicines, cosmetic items, games and electronics. Basically plastic tube packaging is done to protect the materials from extremes of climatic change or to resist rough handling. Materials Used in Plastic Tube Packaging: Like plastics are made from [...]

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The new RT-8BT-8VF from Perfect Packaging is great for the managing the pre made pouch packaging industry. Stainless Steel has been used in the construction of this machine and this makes it highly sturdy, durable and easy to clean. All the filing zones as well as its vacuum chambers are washable easily and this helps [...]

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Antistatic packaging is essential for most electronic products, common and uncommon. These especially include exposed components to be packaged. Excellent examples would be main boards, add-on cards and microchips. Proximity to any electrostatic field can result in the formation of static charges on these components. These components and articles have the propensity to be damaged [...]

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Market acceptability of a product, especially consumer products needed an attractive product cover presentation. Hence, it increases the need for Automatic Packaging machinery.  Most of the consumer products manufacturer companies are using automatic packaging machines for their product’s cover as that gives their products an attractive outlook. You can pack the products automatically by using [...]

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Jordan Valley Semiconductors, the semiconductor metrology equipment manufacturer announced that they have qualified multiple units of their JVX 6200 system to leading memory manufacturers for wafer-level packaging applications. The explosive growth in high density, high pin count devices that demand the more sophisticated types of packaging are now requiring superior metrology. The Jordan Valley JVX [...]

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