Packaging Machinery – News, Technology and Reviews

Latest technologies and news on Packaging Industry with insightful analysis and commentary.

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Entries Tagged as 'Exhibition'

Copper pillar: The new trend in the silicon world

April 23rd, 2011 · No Comments

The International Conference on Elactronics Packaging was held recently from April 13th to April 15th in Nara, Japan. Many laeding companies from the chip market were present for the occassion. The president and founder of TechSearch International, E.Jan Vardaman delivered a key note address and one important point highlighted in her address was the growing [...]

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Tags: Electronics Packaging · Exhibition