Packaging Machinery – News, Technology and Reviews

Latest technologies and news on Packaging Industry with insightful analysis and commentary.

Packaging Machinery – News, Technology and Reviews header image 4

Entries Tagged as 'Latest News'

Modern packaging technology using RDL

June 14th, 2011 · No Comments

Following the proverb “Necessity is the mother of all inventions”, the Redistribution technology was developed to facilitate fan-in area array packaging at a time when very few chips were designed for area array. Since then, this technology has been influential in the development of advanced packaging technologies like TSV based interposers, WLP and chip stacks. [...]

[Read more →]

Tags: Latest News · Researches

Award for excellence in packaging and merchandising

May 18th, 2011 · No Comments

Receiving an award for excellence is the dream of every industry. This dream cannot be fulfilled without proper efforts required for reaching that level and appropriate planning for the sustainable growth. Packaging and merchandising is a challenging industry which requires great effort and planning for receiving such big awards. Recently a leading brand Fiskars won [...]

[Read more →]

Tags: Company News · Latest News

Consulting Services by Bosch Packaging Technology

May 17th, 2011 · No Comments

The leading brand in the field of packaging technology Bosch strongly believes that as competition among the various food and pharmaceutical manufacturers gets more intense, increasing the efficiency is the top priority aim. To support this belief with action Bosch Packaging Technology has introduced its OEE (Overall equipment effectiveness) consulting services. It introduced its consulting [...]

[Read more →]

Tags: Latest News · New Technologies

Multisorb to use Dyadem’s Stature Software for Quality Risk Management

April 28th, 2011 · No Comments

The international leader in active packaging technology Multisorb Technologies has selected Dyadem to assist in providing Quality Risk Management software solutions to meet its goals of superior quality product. Multisorb will make use of Stature software by Dyadem and this will enable its users to use shared knowledge on Quality Risk Management. Multisorb Technologies was [...]

[Read more →]

Tags: Latest News

13% of all IC pakages constitute of Flip Chip packages

April 27th, 2011 · No Comments

The latest report on technological study and market research conducted by Yole Devalopments on Flip Chip has been successfully published. This report contains complete information about flip chip markets, applications of this technnnology, wafer bumping to assembly and the various technologis used in substrates and underfilled materials. A detailed analysis of the cost, supply, value [...]

[Read more →]

Tags: Electronics Packaging · Latest News

Tailor made apprenticeship program by Hull College

April 24th, 2011 · No Comments

Across the East Yorkshire, businesses have been recognizing the benefits of having apprentices in their companies. This piece of news has succeeded the Apprenticeship challenge given by the Mail in which it promised to get one hundred apprentices placed in exactly one hundered days. Now it is a known fact that Apprentices are the most economic way to take [...]

[Read more →]

Tags: Latest News

Winner of prestigious Harry Lovell Award announced by AIP

April 21st, 2011 · No Comments

The Australian Institute of Packging (AIP) announced the winner of the 2011 Henry Lovell Award during the AUSPACK PLUS 2011 held between 22-25 March in Melbourne. The prestigious award is given to recognize an exceptinal achievement by a student in the final eaxaminations before obtaining a Diploma in Packaging Technology. Mr. Misbah Khan, a packaging [...]

[Read more →]

Tags: Latest News

A revolution in quality control with packaging technology!

April 16th, 2011 · No Comments

A significant disadvantage of package technology was visible in terms of quality of the packaged food as it is hard to distinguish between fresh and stake food. However, with the recent development of the sensor film developed by the Fraunhofer Research Institution for Modular Solid State Technologies in Munich the problem has finally ended up [...]

[Read more →]

Tags: Food Packaging · Latest News · New Technologies

US Maintains Lead In Packaging Machinery

April 2nd, 2008 · No Comments

United States has been in the forefront in the production of packaging machineries in the past and for the current year, it is believed that it would still maintain that lead over all the other companies in the global market. This feat can be attributed to several factors including the weaker performance of the dollars [...]

[Read more →]

Tags: Latest News · Manufactures

Sidel Will Prove Its Worth in Interpack 2008

March 13th, 2008 · No Comments

Interpack 2008 in Dusseldorf, Germany will showcase the latest in the packaging solutions technology. This will be a gathering of the top companies in the packaging and processing industry and will serve as a venue for the launching of the latest innovations to answer the needs of manufacturers for packaging materials and solutions. The categories [...]

[Read more →]

Tags: Food Packaging · Latest News