Following the proverb “Necessity is the mother of all inventions”, the Redistribution technology was developed to facilitate fan-in area array packaging at a time when very few chips were designed for area array. Since then, this technology has been influential in the development of advanced packaging technologies like TSV based interposers, WLP and chip stacks. [...]
Entries Tagged as 'Latest News'
Modern packaging technology using RDL
June 14th, 2011 · No Comments
Tags: Latest News · Researches
Award for excellence in packaging and merchandising
May 18th, 2011 · No Comments
Receiving an award for excellence is the dream of every industry. This dream cannot be fulfilled without proper efforts required for reaching that level and appropriate planning for the sustainable growth. Packaging and merchandising is a challenging industry which requires great effort and planning for receiving such big awards. Recently a leading brand Fiskars won [...]
Tags: Company News · Latest News
Consulting Services by Bosch Packaging Technology
May 17th, 2011 · No Comments
The leading brand in the field of packaging technology Bosch strongly believes that as competition among the various food and pharmaceutical manufacturers gets more intense, increasing the efficiency is the top priority aim. To support this belief with action Bosch Packaging Technology has introduced its OEE (Overall equipment effectiveness) consulting services. It introduced its consulting [...]
Tags: Latest News · New Technologies
Multisorb to use Dyadem’s Stature Software for Quality Risk Management
April 28th, 2011 · No Comments
The international leader in active packaging technology Multisorb Technologies has selected Dyadem to assist in providing Quality Risk Management software solutions to meet its goals of superior quality product. Multisorb will make use of Stature software by Dyadem and this will enable its users to use shared knowledge on Quality Risk Management. Multisorb Technologies was [...]
Tags: Latest News
13% of all IC pakages constitute of Flip Chip packages
April 27th, 2011 · No Comments
The latest report on technological study and market research conducted by Yole Devalopments on Flip Chip has been successfully published. This report contains complete information about flip chip markets, applications of this technnnology, wafer bumping to assembly and the various technologis used in substrates and underfilled materials. A detailed analysis of the cost, supply, value [...]
Tags: Electronics Packaging · Latest News
Tailor made apprenticeship program by Hull College
April 24th, 2011 · No Comments
Across the East Yorkshire, businesses have been recognizing the benefits of having apprentices in their companies. This piece of news has succeeded the Apprenticeship challenge given by the Mail in which it promised to get one hundred apprentices placed in exactly one hundered days. Now it is a known fact that Apprentices are the most economic way to take [...]
Tags: Latest News
Winner of prestigious Harry Lovell Award announced by AIP
April 21st, 2011 · No Comments
The Australian Institute of Packging (AIP) announced the winner of the 2011 Henry Lovell Award during the AUSPACK PLUS 2011 held between 22-25 March in Melbourne. The prestigious award is given to recognize an exceptinal achievement by a student in the final eaxaminations before obtaining a Diploma in Packaging Technology. Mr. Misbah Khan, a packaging [...]
Tags: Latest News
A revolution in quality control with packaging technology!
April 16th, 2011 · No Comments
A significant disadvantage of package technology was visible in terms of quality of the packaged food as it is hard to distinguish between fresh and stake food. However, with the recent development of the sensor film developed by the Fraunhofer Research Institution for Modular Solid State Technologies in Munich the problem has finally ended up [...]
Tags: Food Packaging · Latest News · New Technologies
US Maintains Lead In Packaging Machinery
April 2nd, 2008 · No Comments
United States has been in the forefront in the production of packaging machineries in the past and for the current year, it is believed that it would still maintain that lead over all the other companies in the global market. This feat can be attributed to several factors including the weaker performance of the dollars [...]
Tags: Latest News · Manufactures
Sidel Will Prove Its Worth in Interpack 2008
March 13th, 2008 · No Comments
Interpack 2008 in Dusseldorf, Germany will showcase the latest in the packaging solutions technology. This will be a gathering of the top companies in the packaging and processing industry and will serve as a venue for the launching of the latest innovations to answer the needs of manufacturers for packaging materials and solutions. The categories [...]
Tags: Food Packaging · Latest News
