A significant disadvantage of package technology was visible in terms of quality of the packaged food as it is hard to distinguish between fresh and stake food. However, with the recent development of the sensor film developed by the Fraunhofer Research Institution for Modular Solid State Technologies in Munich the problem has finally ended up [...]
Entries Tagged as 'Latest News'
A revolution in quality control with packaging technology!
April 16th, 2011 · No Comments
Tags: Food Packaging · Latest News · New Technologies
US Maintains Lead In Packaging Machinery
April 2nd, 2008 · No Comments
United States has been in the forefront in the production of packaging machineries in the past and for the current year, it is believed that it would still maintain that lead over all the other companies in the global market. This feat can be attributed to several factors including the weaker performance of the dollars [...]
Tags: Latest News · Manufactures
Sidel Will Prove Its Worth in Interpack 2008
March 13th, 2008 · No Comments
Interpack 2008 in Dusseldorf, Germany will showcase the latest in the packaging solutions technology. This will be a gathering of the top companies in the packaging and processing industry and will serve as a venue for the launching of the latest innovations to answer the needs of manufacturers for packaging materials and solutions. The categories [...]
Tags: Food Packaging · Latest News
Bosch Leads Packaging Industry
March 10th, 2008 · No Comments
The packaging industry has become a highly competitive field with innovative designs launched to address the different concerns of the manufacturing industry. Bosch Packaging Industry, a German technology group has set the trend and has remained in the forefront by launching new designs which will make the packaging process more time and cost efficient. The [...]
Tags: Latest News
PACK EXPO 2007 WITH MULTIVAC
September 25th, 2007 · No Comments
The world of medicines is a very delicate and fragile world. When we talk about packaging medical packaging is a vital concern. To address this concern a massive event known as the Pack Expo 2007 is going to be held in the beautiful and ever lively city of Las Vegas in Nevada. The dates for [...]
Tags: Latest News · Pharmaceutical Packaging · Tray Sealing
Full range of Package Printers from Kodak
May 6th, 2007 · No Comments
Kodak flexographic plates range now covers both analog and digital offerings, providing flexo printers with more choice when selecting a technology that best meets their specific needs. Package printers looking for a plate solution can choose from analog KODAK FLEXCEL Flexographic Plates and the MACDERMID Printing System Digital MUST, Digital RAVE and Digital EPIC Digital [...]
Tags: Company News · Latest News · Package Printing
Rockwell Automation contest won by Schneider Packaging
May 5th, 2007 · No Comments
Schneider Packaging, packaging and palletizing equipment developer was recently named the winner of the 2006 Rockwell Automation Rockwell Automation Extreme Machines contest. Schneider Packing is the producer of complete line of case packing and palletizing equipments for manufactures in paper, food and beverage, industrial, plastic and personal care industries. This company was chosen from a [...]
Tags: Carton Packaging · Latest News
Bosch plans to boost Packaging Technology division
May 3rd, 2007 · No Comments
The Bosch Group plans to purchase Pharmatec GmbH, headquartered in Dresden, Germany, from Fresenius ProServe GmbH. The deal also includes the acquisition of the Pharmatec subsidiary Schoeller-Bleckmann Medizintechnik Ges.m.b.H, headquartered in Ternitz, Austria. Pharmatec is a top company in the assembly of systems and lines for the pharmaceutical industry. Its focus is on hygienic and [...]
Tags: Company News · Latest News
Wafer-level packaging from Jordan Valley Semiconductors
May 2nd, 2007 · No Comments
Jordan Valley Semiconductors, the semiconductor metrology equipment manufacturer announced that they have qualified multiple units of their JVX 6200 system to leading memory manufacturers for wafer-level packaging applications. The explosive growth in high density, high pin count devices that demand the more sophisticated types of packaging are now requiring superior metrology. The Jordan Valley JVX [...]
Tags: Electronics Packaging · Latest News
Luminas receives five patents for PhlatLight Technology
May 2nd, 2007 · No Comments
Luminas now bagged total of 11 patents including 6 patents previously granted. Many more patents and expecting near futre as Luminus is committed to protecting its PhlatLight technology (Photonic Lattice) with IP and has filed over 100 additional U.S. and international patent applications. The underlying photonic lattices used in PhlatLight technology direct the photons through [...]
Tags: Latest News · Manufactures · New Technologies
