Packaging Machinery - News, Technology and Reviews

Latest technologies and news on Packaging Industry with insightful analysis and commentary.

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Entries from April 2007

DuPont Nanofiber Technology Wins IDEA Award for Hybrid Membranes

April 30th, 2007 · No Comments

International Engineered Fabrics Conference and Expo presented IDEA Achievement Awards to DuPont. There are two award winning technologies from DuPont, one based on bio-based technology and the other based on nanofiber science – DuPont™ Sorona® polymer and DuPont Hybrid Membrane Technology (HMT).
DuPont™ Sorona® is the first bio-based, renewably sourced polymer from DuPont and contains 37 […]

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Tags: Latest News · New Technologies · Polymer Science

Goepel Electronic introduces AOI system with Extended Colour Technology

April 30th, 2007 · No Comments

SMT/Hybrid/Packaging 2007 trade show in Nuremberg - The small volume manufacturing companies can use the OptiCon SmartLine, designed as desktop system to be used as an offline test station or repair station. At OptiCon SmartLine’s core lies the OptiCon systems well-proven camera-based imaging unit featuring custom telecentric lens as well as a flexible illumination concept […]

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Tags: Latest News · New Technologies

Blister packaging machine from Festo

April 29th, 2007 · No Comments

Festo, one of the leading Pneumatics and mechatronics company has completed an installation for a French packaging machine company. Newly manufactured machines that make both packaging produced through the Carding process and traditional blister pack lines.

The blister packs consist of a transparent hot-shaped shell that is hot sealed to a glossy card and it is […]

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Tags: Latest News · Blister Packaging

RAM-Stack DDR2 Mini-Registered DIMM from Viking InterWorks

April 28th, 2007 · No Comments

The popular designer and manufacturer of memory modules, Viking InterWorks today announced it is shipping a 4GB DDR2 244-pin MiniRDIMM based upon 512Mb DDR2 monolithic die and patented RAM- Stack  packaging technology.
Its specialised packaging technology has superior thermal and electrical properties when compared to other stacking methods. The RAM-Stack package exhibits a low junction-to-board and […]

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Tags: Latest News · New Technologies

Nuremberg advanced packaging technology exhibition

April 28th, 2007 · No Comments

April 24–26 in Nuremberg hosts technical sessions, exhibitions and demonstrated advanced assembly lines. Here are some the companies and their specialised product details.
VDI/VDE-IT production line demonstrated multifunctional packaging, one of the latest trend in electronics packaging. This line and supporting demonstration islands are hosted by academia, VDI/VDE, and industry partners. In the “Optic Meets Electronic” […]

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Tags: Latest News · New Technologies

biodegradeable and compostable packaging for pharmaceuticals

April 28th, 2007 · No Comments

Metabolix and agriculture giant Archer Daniels Midland find crop based solutions (mainly corn) in the place of regular plastics, which is biodegradeable and compostable for pharmaceutical packaging.

New joint venture called Telles has been established to market this technology and commecialise these products. Initially it will be targeted in food and consument product packaging and […]

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Tags: Pharmaceutical Packaging · Latest News · New Technologies

Industrial Packaging Solutions

April 20th, 2007 · No Comments

In the days of heavy industrial goods transaction and transportation, there is lot of competition among all the companies vying for better profits and proper care is adopted in producing, molding, testing and very importantly, packaging. A product packaged elegantly and qualitatively is definitely going to grab attention of the consumers.
So the point of discussion […]

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Tags: Manufactures · Filling and Sealing