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Entries from May 2007
Partners - Useful Packaging Website Resources
May 30th, 2007 · No Comments
Tags: Partners
Heat sealers and equipments
May 17th, 2007 · No Comments
There are separate machines employed for the purpose of sealing precious or fluid elements. One process among many is heat sealing, employed by the heat sealer equipments. As the name suggests, it does the work by applying heat as the main component. Good heat sealing depends on some parameters like temperature, time of sealing and […]
Tags: Wrapping Machines · Filling and Sealing · Tray Sealing · Heat Sealers
Fastest hybrid cushioning system from Pregis
May 9th, 2007 · No Comments
Industry’s most material efficient and fastest hybrid cushioning system called AirSpeed HC system has been introduced by Pregis Corporation. This system is the answer for flexible and cost effective packaging, which is capable of meeting many diverse product protection needs.
According to Tom Wetsch VP of Pregis Product Development division, “The AirSpeed HC System is truly […]
Tags: New products · Company News
PI Packaging group opened consumer research and innovation divisions
May 7th, 2007 · No Comments
Packaging design and branding specialist PI Group has anounced about two new divisions Picu adn Pid8 to complement its exisiting expertise in sturctural packaing and technology, visual branding.
According to PI Group partner Steve Kelsey, the firm had set up the Picu division because it felt many research firms did not fully understand packaging. He said […]
Tags: Company News · Packaging design
Full range of Package Printers from Kodak
May 6th, 2007 · No Comments
Kodak flexographic plates range now covers both analog and digital offerings, providing flexo printers with more choice when selecting a technology that best meets their specific needs.
Package printers looking for a plate solution can choose from analog KODAK FLEXCEL Flexographic Plates and the MACDERMID Printing System Digital MUST, Digital RAVE and Digital EPIC Digital Flexographic […]
Tags: Latest News · Package Printing · Company News
Semiconductor Packaging and Manufacturing Market in Asia
May 5th, 2007 · No Comments
New research from from Frost & Sullivan shows revenue of Asian Semiconductor Packaging and Manufacturing Market, totaled $16.60 billion in 2006, and are likely to reach $28.56 billion in 2010.
The Asian semiconductor packaging market is expecting a solid growth in the coming years, especially with semiconductor companies increasingly outsourcing their manufacturing activities to low-cost Asian […]
Tags: Semiconductor Packaging · Researches
Automatic Electronic Packaging Methods and Machineries
May 5th, 2007 · No Comments
Market acceptability of a product, especially consumer products needed an attractive product cover presentation. Hence, it increases the need for Automatic Packaging machinery. Most of the consumer products manufacturer companies are using automatic packaging machines for their product’s cover as that gives their products an attractive outlook. You can pack the products automatically by using […]
Tags: Electronics Packaging · Packaging Automation
Rockwell Automation contest won by Schneider Packaging
May 5th, 2007 · No Comments
Schneider Packaging, packaging and palletizing equipment developer was recently named the winner of the 2006 Rockwell Automation Rockwell Automation Extreme Machines contest. Schneider Packing is the producer of complete line of case packing and palletizing equipments for manufactures in paper, food and beverage, industrial, plastic and personal care industries. This company was chosen from a […]
Tags: Latest News · Carton Packaging
Tetra Pak invests in new new processing and packaging equipment
May 5th, 2007 · No Comments
Tetra Pak, Sweden based food packaging industry gaint will invest €32.6m in two new centres to develop new processing and packaging equipment for food and drink manufacturers. This private company is considered as the world’s leading suppliers of food packing and processing equipments and it holds 80 percent of the carton market.
According to Dennis Jönsson, […]
Tags: Food Packaging · Company News
3D IC Packaging Technologies strength and weakness
May 3rd, 2007 · No Comments
An updated report to weight the strength and weakness of existing 3D ICs technologies, and see who is the key players int he area of of 3D packaging.
This report highlights the market leaders for 3D packaging technologies, the status of developments, how it will affect the semiconductor food chain. Also includes equipments market forecasts and […]
Tags: New Technologies
