Packaging Machinery - News, Technology and Reviews

April 24–26 in Nuremberg hosts technical sessions, exhibitions and demonstrated advanced assembly lines. Here are some the companies and their specialised product details.

VDI/VDE-IT production line demonstrated multifunctional packaging, one of the latest trend in electronics packaging. This line and supporting demonstration islands are hosted by academia, VDI/VDE, and industry partners. In the “Optic Meets Electronic” station, Fraunhofer IZM and other companies demonstrate optoelectronic packages, modules, optical interface technologies and materials; and assemblies; production technologies; and other products.

The conference conducts 27 half-day tutorials, nine of which are in English. In “Latest Developments in Component Soldering and Adhesive Technologies,” Stefan Strixner, senior process engineer at ZESTRON Europe, presented work on surface requirements across the manufacturing process. Helmut Schweigart, Ph.D., head of application technology at ZESTRON Europe, led “Assembly Surface Analysis Prior to Coating,” a tutorial on reliable coating applications.

Speedprint Technology Ltd., a division of Blakell Europlacer Group, also in Dorset, U.K., demonstrates the SP200avi inline stencil printer at Booth 7-116. It features proprietary look-down/look-down vision alignment with twin roving cameras mounted on independent X/Y gantries to facilitate paste-on-stencil inspection.

Kyzen Corporation exhibits AQUANOX A4625B in Booth 7-410. The aqueous cleaning chemistry for batch washers reportedly removes most flux residues including lead-free formulas. A4625B is supports long tank life and environmentally friendly . Kyzen also is exhibiting the Lonox L5611 aqueous-blend cleaner, solder paste, which removes flux, and uncured adhesives from stencils and misprints.

Europlacer features its Finesse flexible medium- to high-volume placement system. With high-speed and fine-pitch capabilities, the system offers intelligent feeder technology and 198- × 8-mm feeder capacity. On-the-fly vision, smart nozzles and 0201 to 50- × 50-mm QFP placement capability are standard. Stock Management intelligent inventory control system also is displayed.

BPM Microsystems is displaying a full line of device programmers at booth 9-634. The programmers support NAND and NOR flash and include concurrent programming, universal, and fine-pitch automated models.