The popular designer and manufacturer of memory modules, Viking InterWorks today announced it is shipping a 4GB DDR2 244-pin MiniRDIMM based upon 512Mb DDR2 monolithic die and patented RAM- Stack packaging technology.
Its specialised packaging technology has superior thermal and electrical properties when compared to other stacking methods. The RAM-Stack package exhibits a low junction-to-board and low junction-to-case thermal resistance. Other than these thermal benefits, RAM-Stack enables the stacking of up to four DRAMs, therefore eliminating the need for Dual Die Package (DDP) devices.
The 4GB MiniRDIMM has 4 Ranks of 512Mb DDR2 DRAM configured as 512Mx72 operating at 533MHz (PC2-4200). The current module has been designed to support both standard Registered & Address Parity systems requirements as defined by JEDEC. Future designs will utilize 1Gb DDR2 DRAM enabling 8GB of RAM on Mini-DIMM and VLP DIMM form factors.
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