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Wafer-level packaging from Jordan Valley Semiconductors

May 2nd, 2007 · No Comments

Jordan Valley Semiconductors, the semiconductor metrology equipment manufacturer announced that they have qualified multiple units of their JVX 6200 system to leading memory manufacturers for wafer-level packaging applications. The explosive growth in high density, high pin count devices that demand the more sophisticated types of packaging are now requiring superior metrology.
The Jordan Valley JVX 6200 […]

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