New research from from Frost & Sullivan shows revenue of Asian Semiconductor Packaging and Manufacturing Market, totaled $16.60 billion in 2006, and are likely to reach $28.56 billion in 2010.
The Asian semiconductor packaging market is expecting a solid growth in the coming years, especially with semiconductor companies increasingly outsourcing their manufacturing activities to low-cost Asian countries. Along with this tendency intensifying further over the forecast period, the move towards smaller geometries and migration towards fabless business model are also like to be controlling factors in the markets upcoming growth.
According to Jagadeesh Sampath, research analyst at Frost & Sullivan said “The trend towards outsourcing of semiconductor manufacturing activities is the major driver for the Asian semiconductor packaging and manufacturing market and its impact is likely to remain very high throughout the forecast period. Turnkey services, lower material prices, faster turn-around time and inexpensive labor as well as installation and maintenance costs are some of the critical element lending towards this prospering trend.”
In addition, development in technology, especially the move toward smaller process geometries and the implementation of advanced packages are likely to drive the outsourcing of semiconductor packaging and manufacturing to Asia. Form factors of integrated circuits (ICs) are falling considerably and a move towards smaller process technologies such as 90 nm and 65 nm is available in the market. The Asian semiconductor manufacturing and packaging companies are witnessing new business opportunities in these novel technologies and are expected to leverage this prospect and raise their revenues.
The major areas that companies need to care to stay competitive in the market are invest in cutting edge technologies, focus on acquisition and collaborations and establish strategic partnership with customers. Asian Semiconductor Packaging and Manufacturing Market is part of the Semiconductor Growth partnership Services, which also cover research in the following: strategic analysis of world power management ICs market, world discrete power semiconductor market, world display driver IC market, world VLSI design services market.








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