Jordan Valley Semiconductors, the semiconductor metrology equipment manufacturer announced that they have qualified multiple units of their JVX 6200 system to leading memory manufacturers for wafer-level packaging applications. The explosive growth in high density, high pin count devices that demand the more sophisticated types of packaging are now requiring superior metrology.
The Jordan Valley JVX 6200 system enables accurate and precise description of the films used in wafer-level packaging and can calculate the thickness and composition of the metals used in the Redistribution Layer (RDL), Under Bump Metallization (UBM), and lead-free solder alternatives. Cell phones, laptops, cameras and other handheld devices require new chip packages because the gadget size shrinks and features and functions increase. This new wafer-level packaging (WLP) offers the maximum smallest package available, often matches with the size of the chip, and the lowest cost for electrical test and burn-in, and enhances device performance with its minimum length interconnects.
JVX 6200, the advanced x-ray metrology systems were sold during the second half of 2006 and have since been installed and qualified in fabs in the US and Asia Pacific. This company provides semiconductor metrology solutions for thin films based on novel, rapid, non-destructive and non-contacting x-ray technology. Jordan Valley’s x-ray technology enables accurate and precise characterization of all film types, including single layers and multilayer stacks, metals and dielectrics, amorphous, poly-crystal and single crystal films.
Jordan Valley Semiconductors is the parent company of Jordan Valley Applied Radiation, Inc., which manufactures high quality analyzers and advanced laboratory spectrometers for R&D, process control, QC and other applications.
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